Mitsubishi Electric Corporation (Mitsubishi Electric) has announced that it will begin shipping samples of its new NX-type full-SiC (silicon carbide) power semiconductor module for industrial equipment on June 14, 2023.
The module, which reduces internal inductance and incorporates a second-generation SiC chip, is expected to contribute to the realization of more efficient, smaller and lighter-weight industrial equipment.
Power semiconductors
Power semiconductors are increasingly being utilized to convert electric power extra efficiently
Power semiconductors are increasingly being utilized to convert electric power extra efficiently and thereby help to lower the carbon footprint of global society. Expectations are particularly high for SiC power semiconductors because of their capability to significantly reduce power loss.
The demand is expanding for high-power, high-efficiency power semiconductors capable of improving the power-conversion efficiency of components such as inverters used in industrial equipment.
New NX-type full-SiC power semiconductor module
Mitsubishi Electric began releasing power semiconductor modules equipped with SiC chips in 2010. The new module, which features a low-loss SiC chip and optimized electrode structure, reduces internal inductance by 47% compared to its existing predecessor,1 enabling reduced power loss.
Development of this SiC product has been partially supported by Japan’s New Energy and Industrial Technology Development Organization (NEDO).
Product Features
Optimized electrode structure and SiC chip contribute to more efficient, smaller and lighter equipment:
- Electrode structure optimized with laminated electrodes, etc. to achieve internal inductance of 9nH2, 47% lower than that of the existing module.
- Reduced internal inductance suppresses voltage surges to protect equipment, allowing fast switching while also lowering switching and power loss.
- Low-loss second-generation SiC chip incorporates junction field-effect transistor (JFET) doping technology3 to reduce power loss approximately 72% compared to the existing module, contributing to more efficient equipment.
- Reduced power loss helps to reduce heat generation, allowing use of smaller and lighter-weight coolers.
NX-type package compatibility allows new module to easily replace current version:
- External dimensions and pin configurations are compatible with NX-type module despite inclusion of SiC chip, facilitating easy replacements that will help to speed up the design of new equipment.
Next Step
Mitsubishi Electric will continue to expand its lineup of power semiconductor modules to further contribute to more efficient, smaller and lighter industrial equipment.
