Power conversion can often be the bane of product designers, regardless of what they are designing. In space-constrained applications such as cutting-edge IoT devices or handheld medical devices, using standard converter modules can be limited by space, and discrete power conversion design can be costly and untimely.
To help designers get their designs to market faster, RECOM has introduced new 3DPP technology which offers space-conscious, high-performance turnkey power conversion right out of the box.
What is 3DPP?
RECOM RPMB-3.0 series is a 36V 3A SMD complete power module that fits in a 12.2x12.2x3.75mm
3DPP stands for 3D Power Packaging® which is a new offering of cutting-edge, surface-mount DC/DC converters that offers best-in-class performance without a costly footprint. RECOM’s newest assembly process allows for maximum power density and minimal footprints which are significantly smaller than other power conversion modules.
For example, RECOM RPMB-3.0 series is a 36V 3A SMD complete power module that fits in a 12.2x12.2x3.75mm shielded casing and achieves incredible power density and efficiency of up to 94% without the need for any additional components.
In addition to their compact size, 3DPP products enable the implementation of modern reflow soldering assembly which may reduce supply chain and manufacturing complexities during production when compared to more traditional through-hole power solutions.
How is 3DPP different than other power converter modules?
3DPP technology eliminates the need for an internal PCB by mounting intrinsic components directly to a lead frame, thereby reducing the amount of space required by the conversion components within the module. As an order-of-magnitude example, one of the newly available 3DPP switching regulator products – the RPX-1.0 – is only 3mm x 5mm x 1.6mm making it nearly as small as an IC.
This size reduction allows engineers and designers to have more streamlined PCB profiles with integral power conversion without pursuing costly bespoke conversion design. 3DPP technology-enabled devices are available in several package types including LGA, gull-wing, QFN, blocks-and-pillars, and solder balls, which can make a world of difference in space-constrained applications.
3DPP product offerings
3DPP technology’s compact form factor helps reduce the thermal load of a system
Although the size reduction is invaluable to the 3DPP product offerings, there are several other benefits to using a 3DPP product versus a standard potted module that may make 3DPP products even more appealing.
3DPP technology’s compact form factor helps reduce the thermal load of a system, which may reduce the need for additional thermal management systems and ultimately reduce design time.
Benefit
3DPP technology removes the bond wires on the converter IC and places the IC directly on a lead frame, dramatically reducing the thermal resistance. This practice shortens the power paths on the PCB considerably which also allows for higher switching frequencies while still maintaining EMC requirements.
While some applications may require a few passive external components, most filtering is done internally to the 3DPP products and can even include an integrated inductor. Another benefit of their compact size is the tight switching current loops that inherently reduce EMI, making these products extremely valuable in EMC-critical environments.
Where can 3DPP technology be used?
3DPP can be used in any application that requires a minimal converter footprint, high switching frequencies, or reduced EMI. Industries such as medicine, mobilities, energy, IoT, communication/5G, and automotive have already turned to 3DPP technology given its outstanding performance and minimalistic footprint.
For example, RECOM’s RxxCTxxS series is a medical-grade DC/DC converter that is ideal for applications such as communication, current sensing, and medical applications that require robust isolation. As is true with many other RECOM products, evaluation boards are already available for component validation and prototyping.
